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Numerical investigation of different shaped microchannel heat sinks embedded inside silicon substrate of high-power density gan power amplifiers

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dc.contributor.authorYildiz, Orcun
dc.date.accessioned2026-01-22T16:20:58Z
dc.date.issued2023-01-01
dc.description.urihttps://doi.org/10.1615/tfec2023.enh.045829
dc.identifier.doi10.1615/tfec2023.enh.045829
dc.identifier.endpage1180
dc.identifier.openairedoi_________::26ab7c1474662edacaffd23f93f1f2c5
dc.identifier.startpage1165
dc.identifier.urihttps://hdl.handle.net/11527/29198
dc.publisherBegellhouse
dc.relation.ispartofProceeding of 8th Thermal and Fluids Engineering Conference (TFEC)
dc.titleNumerical investigation of different shaped microchannel heat sinks embedded inside silicon substrate of high-power density gan power amplifiers
dc.typeArticle
dspace.entity.typePublication

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