Publication: Fin hat yapısının analizi ve fin hat filtreleri
Loading...
Files
Date
Authors
Advisor
Journal Title
Journal ISSN
Volume Title
Publisher
Fen Bilimleri Enstitüsü
Type
Abstract
Standart mikroşerit devre teknikleri milimetrik devrelerde uygulanabilmesine rağmen kritik toleranslar, küçük boyutların elde edilmesi sırasında oluşabilen yapım sorunları gibi problemler çok daha ciddi boyutlara ulaşır. Çalışma frekansı yükseldikçe ve mikroşerit hat boyutları küçüldükçe şerit genişliklerinin aktif elemanlarla bağlantı yapmaya uygun olmama problemi ortaya çıkar. 1974 yılında Meıer tarafından tümfeştirilmiş devreler için geliştirilmiş özel bir transmisyon hattı olan fin hatlar milimetrik devre tasarımı için uygun yapılardır. Bir tümleşik fin hat yapısında metal finler, dikdörtgen dalga klavuzunun geniş duvarlarını birleştiren dielektrik yüzey üzerine kaplanmışlardır. Kullanılan malzemenin kalınlığı cinsi ve üzerine yerleştirilen finler arasındaki açıklık devrenin özelliklerini belirler. Fin hat problemlerinde yaygın olarak uygulanan analiz yöntemi Spektral Domen Analizi (SDA) yöntemidir. Düzlemsel transmisyon hatlarının Fourrier dönüşümü domeninde (Spektral domen) analizi uzaysal domendeki birçok sayısal metoda göre avantajlar sağlar. Spektral domen analizi yöntemi mikroşerit hatta iletilen boyuna elektrik ve manyetik alanların ihmal edildiği bir alçak frekans yaklaşıklığı olan Quasi-TEM yaklaşımına dayanarak mikroşerit hatların karakteristik empedansı ve faz hızının hesaplanması için Yamashita ve Mittra tarafından geliştirilmiştir. Tezin 3. bölümünde fin hat süreksizliklerinin enine rezonans yöntemi ile analizi incelenmiştir. Bu yöntem iki iletken veya manyetik düzlemi süreksizliğin iki yanına belli uzaklıklarda yerleştirerek kapalı bir rezonatör yapısı elde etmek ve bu rezonatörün rezonans frekanslarından haraketle süreksizliğin eşdeğer devre parametrelerinin bulun masına dayanır. Son olarak direkt küple rezonatörlü filtrelerin tasarımı için, çeşitli tip süreksizliklere karşı düşen, kayıpsız ve simetrik iki kapılılar ile çeşitli uzunluktaki modal transmisyon hatlarının kaskat bağlanması ile oluşan simetrik filtre devrelerinde giriş yansıma katsayısı fonksiyonunun eksplisit ifadesi verilmekte ve bu fonksiyonun özelliklerinden yarar lanılarak, seçilecek belli bir eşdeğerlik frekansında, verilen tasarım parametrelerine karşı düşen araya girme kaybı fonksiyonlarından giriş yansıma katsayısı pay polinomlarının faktorize edilebileceği gösterilerek bu yöntem fin hatla simetrik yapıda filtrelerin tasarımına uygulanmak tadır. Ayrıca fin hattın transmisyon borusuna kuplajıda incelenerek fin hattan transmisyon borusuna geçişi sağlayan empedans adaptörünün genel tasarım bağıntıları verilmiştir. Bu çalışmada ele alınan konular ayrı ayrı literatürde mevcut olmakla beraber fin hatlı bir filtre tasarımına uygulanışları açısından bir yenilik içermektedirler.
Increased activity in the spectrum above 30 GHz has recently stir red interest in the development of milimeter wave integrated circuits. Much of the enthusiasm associated with integrated circuits can be traced to the clear advantages that such circuits provide below 3 GHz., namely, reduced size, weight, and cost combined with improved electrical perfor mance, production uniformity, and reliability. However, these who have worked with integrated circuits at centimeter wavelengths (3-30 GHz.) have encountered some fundamental problems which have limited the uti lity of such circuits. These problems include the critical tolerances and questionable production uniformity that can occur when miniaturization is carried too far. Although standard microstrip techniques can be applied to milime ter components, the problems listed above can be expected to become mo re severe. As the operating frequeny is raised and the microstrip dimen sions are decreased, a limit will be reached where the strip width is no longer compatible with chip and beam lead devices. In addition, milimet- ric integrated circuits must be tailored to requirements that are general ly different from those which apply at lower frequencies. For example the ability to construct a simple transition to waveguide becomes impor tant at milimeter wavelengths where coaxial instrumentation is not practical. Designers of milimeter equipment have historically selected Quasi-Optical approaches to increase the physical size of components and thereby ease tolerance problems and improve performance. Thus the ideal transmission line for milimeter integrated circuit is one which avoids miniaturization and yet offers the potential for low-cost produc tion through batch-processing techniques. Integrated fin-line is such a transmission line. In an integrated fin-line structure, metal fins are printed on a die lectric substrate which bridges the broad walls of a rectangular wavegu ide. The dimensions of practical fin-line circuits remain compatible with chip and beam-lead devices throughout the milimeter spectrum, the reby offering great potential for the construction of active and passive hybrid integrated circuits. In addition to serving as the bonding areas for hybrid devices, the printed fins increase the seperation between the first two modes of pro pagation thereby providing a wider useful bandwidth than conventional waveguide. The low-loss properties of integrated fin-line have been experimen tally demonstrated through transmission tests at milimeter wave- lenghts. Two different fin line configurations, as shown in Fig.1 were eva luated. In the configuration of Fig.1-a, the fins are printed on opposite sides of a single dielectric substrate. Since the fins are directly groun ded to the metal waveguide walls, this configuration is applicable only to passive devices. In the configuration of Fia,1-b, however, the fins are printed on the mating surfaces of two dielectric substrates. Since the fins are insulated from the waveguide at dc, bias may be introduced for active components. RF continuity between the fins and the waveguide viiwall is obtained by choosing the thickness of the broad walls to be a qu arter wavelength in the dielectric medium and by selecting c«a. metal fin dielectric surface I -A (a) (b) Figure. 1 Possible fin line realizations. Fin lines are generally grouped into three types according to the settlement of the fins onto the dielectric surface. Fig.2 shows unilate ral, bilateral and antipodal fin-lines. (a) (b) (c) Hgure.2 The three type of fin lines. In the second section, the spectral domain approach which is superi or for many numerical methods in the spatial domain is introduced. The analysis in the Fourrier transform domain was first introduced by Yamashita and Mittra for computation of the characteristic impedance and the phase velocity of a microstrip line based on quasi TEM approxi mation. As the operating frequency is increased, dispersion characteristics of the microstrip become important for precise designs. A new method was presented by Itoh and Mittra, commonly calleathe spectral domain VIIIThe values of pfor the fin line with dimensions of a=7,112mm, b=3,556mm, d=0,125mm, w=0,5mm, &=3 (see Fig. 5) are calculated at dif ferent frequencies by using the algorithm given in appendix C. As depic ted in Fig.6 p changes lineerly with the frequency. +-
Increased activity in the spectrum above 30 GHz has recently stir red interest in the development of milimeter wave integrated circuits. Much of the enthusiasm associated with integrated circuits can be traced to the clear advantages that such circuits provide below 3 GHz., namely, reduced size, weight, and cost combined with improved electrical perfor mance, production uniformity, and reliability. However, these who have worked with integrated circuits at centimeter wavelengths (3-30 GHz.) have encountered some fundamental problems which have limited the uti lity of such circuits. These problems include the critical tolerances and questionable production uniformity that can occur when miniaturization is carried too far. Although standard microstrip techniques can be applied to milime ter components, the problems listed above can be expected to become mo re severe. As the operating frequeny is raised and the microstrip dimen sions are decreased, a limit will be reached where the strip width is no longer compatible with chip and beam lead devices. In addition, milimet- ric integrated circuits must be tailored to requirements that are general ly different from those which apply at lower frequencies. For example the ability to construct a simple transition to waveguide becomes impor tant at milimeter wavelengths where coaxial instrumentation is not practical. Designers of milimeter equipment have historically selected Quasi-Optical approaches to increase the physical size of components and thereby ease tolerance problems and improve performance. Thus the ideal transmission line for milimeter integrated circuit is one which avoids miniaturization and yet offers the potential for low-cost produc tion through batch-processing techniques. Integrated fin-line is such a transmission line. In an integrated fin-line structure, metal fins are printed on a die lectric substrate which bridges the broad walls of a rectangular wavegu ide. The dimensions of practical fin-line circuits remain compatible with chip and beam-lead devices throughout the milimeter spectrum, the reby offering great potential for the construction of active and passive hybrid integrated circuits. In addition to serving as the bonding areas for hybrid devices, the printed fins increase the seperation between the first two modes of pro pagation thereby providing a wider useful bandwidth than conventional waveguide. The low-loss properties of integrated fin-line have been experimen tally demonstrated through transmission tests at milimeter wave- lenghts. Two different fin line configurations, as shown in Fig.1 were eva luated. In the configuration of Fig.1-a, the fins are printed on opposite sides of a single dielectric substrate. Since the fins are directly groun ded to the metal waveguide walls, this configuration is applicable only to passive devices. In the configuration of Fia,1-b, however, the fins are printed on the mating surfaces of two dielectric substrates. Since the fins are insulated from the waveguide at dc, bias may be introduced for active components. RF continuity between the fins and the waveguide viiwall is obtained by choosing the thickness of the broad walls to be a qu arter wavelength in the dielectric medium and by selecting c«a. metal fin dielectric surface I -A (a) (b) Figure. 1 Possible fin line realizations. Fin lines are generally grouped into three types according to the settlement of the fins onto the dielectric surface. Fig.2 shows unilate ral, bilateral and antipodal fin-lines. (a) (b) (c) Hgure.2 The three type of fin lines. In the second section, the spectral domain approach which is superi or for many numerical methods in the spatial domain is introduced. The analysis in the Fourrier transform domain was first introduced by Yamashita and Mittra for computation of the characteristic impedance and the phase velocity of a microstrip line based on quasi TEM approxi mation. As the operating frequency is increased, dispersion characteristics of the microstrip become important for precise designs. A new method was presented by Itoh and Mittra, commonly calleathe spectral domain VIIIThe values of pfor the fin line with dimensions of a=7,112mm, b=3,556mm, d=0,125mm, w=0,5mm, &=3 (see Fig. 5) are calculated at dif ferent frequencies by using the algorithm given in appendix C. As depic ted in Fig.6 p changes lineerly with the frequency. +-
Description
Tez (Yüksek Lisans) -- İstanbul Teknik Üniversitesi, Fen Bilimleri Enstitüsü, 1991
Subject
Filtreler, Fin hat, Spektral domen analizi, Tasarım, Filters, Fin line, Spectral domen analysis, Design